Through the migration of organosilicon to the interfacial layer of the E/P/E multilayer co-extruded encapsulant film, In-situ UV polymerization formed a bonding layer in the EPE co-extruded film. This significantly enhances the interlayer peel strength between EVA and POE encapsulation films.

Enhancing the light transmittance of transparent encapsulant films, maximizing the reflection angle of white films, and achieving high-transparency diffusion effects; developing highier reflective EVA white film products with superior light-gain performance, as well as optical matte diffusion films.

By reducing the release of ions and acetate ions, while enhancing ion- and acetate-capturing technology, we improve the long-term stability of EVA encapsulant films after aging. This helps minimize corrosion and ion deposition, enabling anti-PID EVA encapsulant films for bifacial solar module applications.

Significantly improves adhesion to materials with both high or low surface energy, such as PTFE, ETFE, PVDF, PP, metals, metal oxides, and coatings, enabling the bonding of materials with significantly different surface energies. This includes encapsulation films for HTJ, perovskite encapsulation films, and thin-film solar cell encapsulation.

By releasing curing agents via microcapsules, the curing behavior is precisely adjusted. During low-temperature extrusion, sensitivity to thermal crosslinking is minimized; conversely, during high-temperature lamination, the capsules release curing agents to rapidly accelerate the crosslinking rate, thereby enhancing module encapsulation efficiency.
With customized formulation, die, and screw design, precise extrusion speed control, could enhance the ultra-speed which is exceeding the industry average speed by 50%.