Perovskite Module Solution
- Our next-generation encapsulation film designed specifically for perovskite applications adopts a unique formulation.
- Through technologies such as polymer grafting and nano-interconnection, it enables low-temperature, rapid lamination and delivers high interlayer peel strength.
- At the same time, it effectively addresses issues related to residual polar small molecules and long-term storage degradation.
- This solution provides enhanced protection for sensitive tandem cells and offers stronger support for the stability of perovskite and perovskite-based tandem modules.