0BB Module Solution
- Our “0BB skin film encapsulation solution” uses low-gram-weight EVA skin film, delivering stable product performance, with light transmittance ≥92%, haze ≤3%, and thermal shrinkage ≤2.5%.
- It provides excellent lamination yield. After lamination, the appearance and EL performance are good, with no issues such as virtual soldering or air bubbles.
- After adopting our dedicated 0BB encapsulation solution, the power degradation in double IEC testing is less than 3%, and there are no appearance or EL defects after TC600.
- This solution enables a lower LCOE, improves the power output of 0BB modules, and reduces encapsulation costs.
- Front side: Co-extruded EPE film (B602M)/ High transmittance EVA film (B601HP) + skin film (B601HP 0BB).
- Rear side: Co-extruded EPE film (B602M)/ High transmittance EVA film (B601HP) + skin film (B601HP 0BB).