Since its rapid application in 2023, 0BB (Zero Busbar) technology has become one of the most important interconnection innovations for next-generation solar cell technologies such as TOPCon, HJT, Perovskite, IBC, etc. This milestone in busbar design has created new opportunities for significantly reducing silver paste consumption.
0BB Module Encapsulation Technology
The transition from MBB (Multi Busbar) to SMBB (Super Multi Busbar) has already reduced silver paste usage consumption obviously. However, is there still a possibility for further optimization?
The answer is 0BB technology.
Comparing conventional busbar designs, 0BB completely eliminates the main busbars while optimizing the width and spacing of the fine fingers.
Compared with SMBB technology, 0BB offers the following advantages:
- Lower silver paste consumption, reducing overall module manufacturing costs
- More solder ribbons with smaller cross-sections, decreasing electrical resistance and increasing module output power
- More current collection points, effectively mitigating power loss caused by microcracks
Currently, four major technical approaches are used for 0BB:
- SWCT (Smart Wire Connect Technology)
- IFC Lamination Film
- Dispensing
- Soldering + Dispensing
Among them, Smart Wire remains protected by patents and is only available to a limited number of manufacturers. The other three approaches have attracted significant industry attention.
As a leading manufacturer of photovoltaic encapsulation materials, Betterial has already established mature supporting solutions for IFC lamination films, dispensing, and soldering-dispensing processes, enabling reliable large-scale implementation of 0BB technology.
Betterial’s “Skin Film + Low-GSM EPE Film” 0BB Encapsulation Solution
The busbar-free structure of 0BB is highly distinctive. To achieve ideal metallurgical bonding between solder ribbons and solar cells during lamination, the encapsulant must exhibit low melt flow performance, preventing incomplete connections.
To address these challenges, Betterial developed its “Skin Film + Low-GSM EPE Encapsulation Film” solution.
This solution incorporates a high-adhesion modified resin system that provides:
- Lower resin melt during lamination
- Higher bonding-layer hardness
- Stronger adhesion between encapsulation film and solar cells
- Excellent ribbon encapsulation throughout the lamination process
These characteristics significantly improve manufacturing yield while enhancing long-term module reliability.
Validation testing of Betterial’s 0BB Skin Film solution demonstrates:
- No EL-detected virtual solder joints after lamination
- Excellent visual appearance
- Outstanding performance in TC200 thermal cycling tests
Throughout PV module innovation, for significant cost savings, manufacturers continuously pursue four critical objectives:
- Lower silver consumption
- Thinner solar wafers
- Higher efficiency
- Higher manufacturing yield
Betterial’s 0BB encapsulation solution delivers clear advantages across all four objectives.
1. Higher Efficiency
For identical module designs, Betterial’s encapsulation solution enables the use of finer solder ribbons with reduced shading area, module power output can increase by approximately 0.7%–1.0%.
2. Lower Silver Consumption
Effectively reduce solar cell paste consumption while providing more stable support for silver-coated copper paste (Ag-coated Cu) and copper coating interconnection technologies, significantly lowering silver paste usage.
3. Thinner Solar Wafers
Betterial’s Skin Film technology supports low-temperature soldering, making it better suited for thinner silicon wafers and further reducing silicon consumption.
4. Higher Manufacturing Yield
Betterial’s 0BB encapsulation technology provides superior ribbon encapsulation during lamination, improving PV module manufacturing yield while enhancing product reliability and long-term stability.
Integrated Film Technology Creates New Opportunities for Cost Reduction
During practical application, Betterial identified several challenges associated with the Skin Film solution:
- Higher manufacturing costs
- More demanding production requirements for low-GSM films
- Two separate laying-outprocesses during module assembly
- Additional equipment upgrade required
To further reduce the cost of 0BB manufacturing, Betterial leveraged over a decade of expertise in PV encapsulation technology to develop its Integrated Film Technology, offering customized integrated encapsulation solutions tailored to different customer technical requirements.
Innovation never stops. As encapsulation materials and equipment technologies continue to advance, directly encapsulating 0BB modules with standard encapsulation films will become the preferred path to achieving further cost reductions in 0BB encapsulation.