PIR Thermal Insulation Cushioning Board
- PIR thermal insulation cushioning board is a sandwich-structured composite material made by integrating inorganic materials such as fiberglass, ceramic, pre-oxidized fiber, or aluminum foil with modified rigid polyurethane foam.
- It features low thermal conductivity, flame retardancy, lightweight design, cushioning, shock absorption, hydrophobicity, long service life, and high toughness.
- With thermal conductivity as low as 0.018–0.023 W/(m·K), an operating temperature range of -200°C to +300°C, and flame retardancy up to UL94 V-0, it provides reliable thermal insulation, protection, and structural support in demanding environments.
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|
Item |
Specifications |
|
Surface Material Thickness |
0.8-1mm |
|
Panel Thickness |
5-10mm |
|
Fire Performance |
Meets UL94 and GB/T 8624-2012 overall Class A fire performance, and complies with EN45545 HL3 R1 and TB/T 3139. |
|
PIR Core Thickness |
10-50mm |
|
Tensile Strength |
≥1.5MPa |
|
Thermal Conductivity |
0.018-0.023w/m.k |
|
Operating Wind Pressure (P) |
2500Pa＜P≤3500Pa |
|
Water Absorption |
≤1.5%（28D） |
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Operating Temperature Range |
-200℃ ~ +300℃ |
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Environmental Requirements |
No formaldehyde emission; VOCs ≤6 g/kg
No soluble lead or cadmium |
